Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2006-06-20
2006-06-20
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C438S042000, C438S046000, C438S047000
Reexamination Certificate
active
07063995
ABSTRACT:
The light emitting device includes a p type nitride semiconductor layer, a light emitting layer and an n type nitride semiconductor layer stacked on an Si (silicon) substrate in this order from the side of the Si substrate. The Si substrate is partially removed to expose a part of the p type nitride semiconductor layer. On the exposed region of the p type nitride semiconductor layer, a p type electrode is formed.
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Patent Abstracts of Japan of Publication No. 2001007395A published on Jan. 12, 2001.
Fudeta Mayuko
Hata Toshio
Kimura Daigaku
Louie Wai-Sing
Morrison & Foerster / LLP
Sharp Kabushiki Kaisha
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