Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-02-28
2006-02-28
Vo, Peter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S840000, C228S180220, C228S245000, C228S246000, C228S040000, C219S121640, C219S085130
Reexamination Certificate
active
07003874
ABSTRACT:
Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface. The solder ball is retained within the hole in an ambient processing environment which is generally uniform over the entirety of the ball's outer surface. While the solder ball is within the hole, the solder ball is bonded with an associated bond pad on a substrate.
REFERENCES:
patent: 3647533 (1972-03-01), Hicks
patent: 4661192 (1987-04-01), McShane
patent: 4831724 (1989-05-01), Elliott
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5052102 (1991-10-01), Fong et al.
patent: 5159171 (1992-10-01), Cook et al.
patent: 5164566 (1992-11-01), Spletter et al.
patent: 5219117 (1993-06-01), Lin
patent: 5279045 (1994-01-01), Odashima et al.
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5479703 (1996-01-01), Desai et al.
patent: 5495089 (1996-02-01), Freedman et al.
patent: 5551148 (1996-09-01), Kazui et al.
patent: 5620927 (1997-04-01), Lee
patent: 5654204 (1997-08-01), Anderson
patent: 5655704 (1997-08-01), Sakemi et al.
patent: 5741410 (1998-04-01), Tsurushima
patent: 5745986 (1998-05-01), Variot et al.
patent: 5750199 (1998-05-01), Sakemi
patent: 5762258 (1998-06-01), Le Coz et al.
patent: 5763854 (1998-06-01), Dittman et al.
patent: 5782399 (1998-07-01), Lapastora
patent: 5839641 (1998-11-01), Teng
patent: 5899737 (1999-05-01), Trabucco
patent: 5941449 (1999-08-01), Le Coz et al.
patent: 5977512 (1999-11-01), Azdasht et al.
patent: 6056190 (2000-05-01), Foulke et al.
patent: 6063701 (2000-05-01), Kuwazaki et al.
patent: 6162661 (2000-12-01), Link
patent: 6234382 (2001-05-01), Rischke et al.
patent: 6268275 (2001-07-01), Cobbley et al.
patent: 6412685 (2002-07-01), Hertz et al.
patent: 2002/0040521 (2002-04-01), Farnworth et al.
patent: 0 964 608 (1999-12-01), None
patent: 8-118005 (1996-05-01), None
patent: 1007949 (1998-01-01), None
patent: WO 98/12738 (1998-03-01), None
patent: WO 99/17593 (1999-04-01), None
Yariv, Amnon, “Quantum Electronics—Second Edition,” ©1967, 1975, by John Wiley & Sons, Inc., pp. 176-193.
Yariv, Amnon, “Quantum Electronics—Second Edition,” ©1967, 1975, by John Wiley & Sons, Inc., pp. 300-307.
Eisberg et al., “Quantum Physics of Atoms, Molecules, Solids, Nuclei, and Particles,” ©1974 by John Wiley & Sons, Inc., p. 316.
Eisberg et al., “Quantum Physics of Atoms, Molecules, Solids, Nuclei, and Particles,” ©1974 by John Wiley & Sons, Inc., pp. 425-433.
Merriam Webster's Collegiate Dictionary—Tenth Edition, ©1996, pp. 327, 613 and 656 (total of 5 pages).
Merriam Webster's Collegiate Dictionary—Tenth Edition, ©1996, p. 327 (1 page).
Kasulke, P., et al., “Solder Ball Bumper (SBB)—A Flexible Equipment for FC, CSP, BGA and Printed Circuit Boards”, “An Innovative Solution for Solder Application Solder Ball Bumper (SBB)”, Pac Tech Packaging Technologies GmbH and Fraunhofer IZM, pp. 1-8.
Kasulke et al., Solder Ball Bumper(SBB)—A Flexible Equipment for FC, CSP, BGA and Printed Circuit Boards/An Innovative Solution for, Solder Application Solder Ball Bumper(SBB),Pac Tech Packaging Technologies GmbH and Fraunhofer IZM, pp. 1-8.
Farnworth Warren M.
Wood Alan G.
Micro)n Technology, Inc.
Tugbang A. Dexter
Vo Peter
Wells St. John P.S.
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