Multi-platen multi-slurry chemical mechanical polishing process

Abrading – Abrading process – Combined abrading

Reexamination Certificate

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C451S060000, C451S041000

Reexamination Certificate

active

07125321

ABSTRACT:
A multi-platen, multi-slurry chemical mechanical polishing method comprises providing a substrate having a surface that includes at least one nitride structure and an oxide layer atop the nitride structure, performing a first CMP process on the substrate using a first platen with a silica based slurry to remove a bulk portion of the oxide layer without exposing the nitride structure, performing a second CMP process on the substrate using a second platen with a ceria based slurry to remove a residual portion of the oxide layer and to expose at least a portion of the nitride structure, and performing a third CMP process on the substrate using the first platen with a silica based slurry to remove at least one defect caused by the ceria based slurry.

REFERENCES:
patent: 6069081 (2000-05-01), Kelleher et al.
patent: 6227949 (2001-05-01), Yi et al.
patent: 6593240 (2003-07-01), Page
patent: 2002/0173221 (2002-11-01), Li et al.
patent: 2004/0005845 (2004-01-01), Kitajima et al.
patent: 2005/0075052 (2005-04-01), Kim et al.
patent: 2005/0075056 (2005-04-01), Wu et al.

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