Semiconductor device using bumps, method for fabricating...

Details Semiconductor device using bumps, method for fabricating... Semiconductor device using bumps, method for fabricating...

2006-02-28

2006-02-28

Guerrero, Maria F. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S678000, C257S738000, C257S778000, C257S780000

Reexamination Certificate

active

07005743

ABSTRACT:
A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the electrodes and bumps between a wiring board formed with a plurality of electrodes and an IC chip formed with a plurality of bumps, the bumps being formed under the condition that the following formula is satisfied.in-line-formulae description="In-line Formulae" end="lead"?100<((ΦA×F)/H)<125in-line-formulae description="In-line Formulae" end="tail"?where ΦA represents the top diameter of a bump bonded with an electrode, H the height of a bump projecting from the IC chip and bonded with an electrode, and F the linear thermal expansion coefficient of the sealing resin.

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