Method for manufacturing electric element built-in module...

Details Method for manufacturing electric element built-in module... Method for manufacturing electric element built-in module...

2006-11-14

2006-11-14

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S835000, C029S739000, C029S740000, C228S110100, C174S520000, C174S521000

Reexamination Certificate

active

07134198

ABSTRACT:
A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring pattern, sealing the electric element with a thermosetting resin composition, and grinding or abrading the thermosetting resin composition and electric element from a side of the electric element opposite that of the wiring pattern. The method provides upper surfaces of the electric element and the thermosetting resin composition that are substantially flush with each other. The method provides an electric element built-in module suitable for high-density packaging with a reduced thickness without damaging the electric element and while maintaining mechanical strength.

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