Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-08-01
2006-08-01
Cao, Phat X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000
Reexamination Certificate
active
07084498
ABSTRACT:
A semiconductor device which includes a semiconductor chip, an insulating film formed on the semiconductor chip, a plurality of projected stress relaxation materials formed on the insulating film, projected electrodes covering at least tops of the stress relaxation materials, and wiring lines for electrically connecting the projected electrodes and element electrodes of the semiconductor chip.
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Hozoji Hiroshi
Kanda Naoya
Tenmei Hiroyuki
Tsunoda Shigeharu
Yamaguchi Yoshihide
Cao Phat X.
Renesas Technology Corp.
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