Method of production of multilayer circuit board with...

Details Method of production of multilayer circuit board with... Method of production of multilayer circuit board with...

2006-11-14

2006-11-14

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S841000, C029S846000, C174S259000, C257S758000, C361S664000, C438S459000

Reexamination Certificate

active

07134195

ABSTRACT:
A method of production of a multilayer circuit board comprised of a multilayer structure circuit formed by a plurality of interconnect layers and insulation layers stacked together and a semiconductor chip included therein, including the steps of placing a semiconductor chip having a polished back surface, with its active surface facing downward, on an already formed lower interconnect layer and forming an insulation layer over the layer on which the semiconductor chip has been placed, the method further including the step of treating the polished back surface of the semiconductor chip to improve its bondability with the insulation layer before the step for formation of the insulation layer.

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European Search Report and Annex date Oct. 25, 2005 of EP 04 25 1460.

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