Liquid cooling system including a liquid absorption and a...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C340S605000, C073S040000, C073S046000, C174S015100, C165S080400, C257S714000

Reexamination Certificate

active

07142425

ABSTRACT:
Disclosed herein is an electronic apparatus that comprises a housing, and a circulating path. A heat-generating component is contained in the housing. Liquid coolant for cooling the heat-generating component flows through the circulating path. The circulating path has a first connecting end and a second connecting end connected to the first connecting end. The junction between the first connecting end and the second connecting end is covered with a coolant-absorbent member. The electronic apparatus further includes a leak detection system to alert the user of a fluid leak within the apparatus and a liquid absorption means to absorb any leaking fluid.

REFERENCES:
patent: 2477533 (1949-07-01), Whiting
patent: 4990541 (1991-02-01), Nielsen et al.
patent: 5323847 (1994-06-01), Koizumi et al.
patent: 5383340 (1995-01-01), Larson et al.
patent: 6199915 (2001-03-01), Becker
patent: 6510052 (2003-01-01), Ishikawa et al.
patent: 6519148 (2003-02-01), Nakagawa et al.
patent: 6556439 (2003-04-01), Shibasaki
patent: 6611425 (2003-08-01), Ohashi et al.
patent: 6776421 (2004-08-01), Florence et al.
patent: 2002/0039279 (2002-04-01), Ishikawa et al.
patent: 2003/0151892 (2003-08-01), Kondo et al.
patent: 2004/0105234 (2004-06-01), Messina et al.
patent: 2005/0243510 (2005-11-01), Tomioka et al.
patent: 58-106852 (1983-06-01), None
patent: 4-258591 (1992-09-01), None
patent: 7-35453 (1995-02-01), None
patent: 7-142886 (1995-06-01), None
patent: 2002-232176 (2002-08-01), None
patent: 2003-124672 (2003-04-01), None
Notification of Reasons for Rejection mailed by the Japanese Patent Office on Oct. 12, 2004, for Japenese Patent Application No. 2002-245372, and English-language translation of Notification.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Liquid cooling system including a liquid absorption and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid cooling system including a liquid absorption and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid cooling system including a liquid absorption and a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3649566

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.