Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-28
2006-11-28
Lea-Edmonds, Lisa (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C340S605000, C073S040000, C073S046000, C174S015100, C165S080400, C257S714000
Reexamination Certificate
active
07142425
ABSTRACT:
Disclosed herein is an electronic apparatus that comprises a housing, and a circulating path. A heat-generating component is contained in the housing. Liquid coolant for cooling the heat-generating component flows through the circulating path. The circulating path has a first connecting end and a second connecting end connected to the first connecting end. The junction between the first connecting end and the second connecting end is covered with a coolant-absorbent member. The electronic apparatus further includes a leak detection system to alert the user of a fluid leak within the apparatus and a liquid absorption means to absorb any leaking fluid.
REFERENCES:
patent: 2477533 (1949-07-01), Whiting
patent: 4990541 (1991-02-01), Nielsen et al.
patent: 5323847 (1994-06-01), Koizumi et al.
patent: 5383340 (1995-01-01), Larson et al.
patent: 6199915 (2001-03-01), Becker
patent: 6510052 (2003-01-01), Ishikawa et al.
patent: 6519148 (2003-02-01), Nakagawa et al.
patent: 6556439 (2003-04-01), Shibasaki
patent: 6611425 (2003-08-01), Ohashi et al.
patent: 6776421 (2004-08-01), Florence et al.
patent: 2002/0039279 (2002-04-01), Ishikawa et al.
patent: 2003/0151892 (2003-08-01), Kondo et al.
patent: 2004/0105234 (2004-06-01), Messina et al.
patent: 2005/0243510 (2005-11-01), Tomioka et al.
patent: 58-106852 (1983-06-01), None
patent: 4-258591 (1992-09-01), None
patent: 7-35453 (1995-02-01), None
patent: 7-142886 (1995-06-01), None
patent: 2002-232176 (2002-08-01), None
patent: 2003-124672 (2003-04-01), None
Notification of Reasons for Rejection mailed by the Japanese Patent Office on Oct. 12, 2004, for Japenese Patent Application No. 2002-245372, and English-language translation of Notification.
Hisano Katsumi
Tomioka Kentaro
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Lea-Edmonds Lisa
Pape Zachary
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