Method and apparatus for joining protective tape to...

Details Method and apparatus for joining protective tape to... Method and apparatus for joining protective tape to...

2006-10-10

2006-10-10

Gray, Linda (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S522000, C156S523000

Reexamination Certificate

active

07118645

ABSTRACT:
A method for joining a protective tape to a semiconductor wafer includes the steps of: mounting a semiconductor wafer, which has a surface with a pattern formed thereon, on a holding member; joining a protective tape, which protects the pattern, to the surface of the semiconductor wafer and, also, to a surface of an outer peripheral member disposed around the holding member; and cutting out the protective tape along an outer circumference of the semiconductor wafer. The holding member and the outer peripheral member are disposed on a holding table, which holds the semiconductor wafer, so as to be adjacent to each other, and the outer peripheral member is formed from a member which is different from that of the holding table.

REFERENCES:
patent: 60-231328 (1985-11-01), None
patent: 62-174940 (1987-07-01), None
patent: 10-112492 (1998-04-01), None
patent: 2003-209082 (2003-07-01), None

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