Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-10-24
2006-10-24
Thai, Luan (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S700000, C257S702000, C257S703000
Reexamination Certificate
active
07126215
ABSTRACT:
This application discloses an apparatus comprising a substrate including a plurality of conducting layers and a nanocomposite inter-layer dielectric (ILD) sandwiched between the conducting layers, wherein the nanocomposite ILD layer comprises a nanocomposite including a polymer having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Also disclosed is an apparatus comprising a substrate having a contact surface and a nanocomposite solder resist layer placed on the contact surface, wherein the solder resist comprises a nanocomposite including a polymer binder having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Further disclosed is a process comprising providing a plurality of conducting layers and sandwiching a nanocomposite inter-layer dielectric (ILD) between the conducting layers, wherein the nanocomposite ILD layer comprises a nanocomposite including a polymer binder having a plurality of nanoclay particles dispersed therein, the nanoclay particles having a high aspect ratio. Other apparatus and process embodiments are also disclosed and claimed.
REFERENCES:
patent: 3258387 (1966-06-01), Brown et al.
patent: 6653388 (2003-11-01), Barbee et al.
patent: 2003/0030999 (2003-02-01), Satsu et al.
patent: 2004/0025743 (2004-02-01), Wakizaka et al.
patent: 0 633 295 (1995-01-01), None
patent: 0 873 047 (1998-10-01), None
patent: 0873047 (1998-10-01), None
patent: 0 479 729 (2004-11-01), None
patent: 1479729 (2004-11-01), None
patent: WO 01/40380 (2001-06-01), None
patent: US2005/010209 (2005-09-01), None
Uhl, F.M. et al., “UV Curable Polymers with Organically Modified Clay as the Nanoreinforcements”, Mat. Res. Soc. Symp. Proc. vol. 788 © 2004 Materials Research Society, pp. 203-208.
Alexandre, M. et al., “Polymer-Layered Silicate Nanocomposites: Preparation, Properties and Uses of a New Class of Materials”, Materials Science and Engineering, vol. 28, No. 1-2, Jun. 2000, pp. 1-63.
Yano, K. et al., “Synthesis and Properties of Polyimide-Clay Hybrid Films”, Polym Chem, vol. 35, 1997, pp. 2289-2294.
Anonymous, “Radiation Cured Substrate for Circuit Cards”, Research Disclosure, Kenneth Mason Publications, vol. 308, No. 54, Dec. 1989.
Koning Paul A.
Matayabas, Jr. James Christopher
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