Use of adjusted evaporator section area of heat pipe that is...

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080300, C165S080400, C165S185000, C165S122000, C257S706000, C257S714000, C257S715000, C257S721000, C257S722000, C361S689000, C361S690000, C361S694000, C361S695000, C361S696000, C361S697000, C361S698000, C361S699000, C361S700000, C361S703000, C361S704000

Reexamination Certificate

active

07131487

ABSTRACT:
An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat absorber is greater than a width of the base.

REFERENCES:
patent: 4966226 (1990-10-01), Hamburgen
patent: 5076351 (1991-12-01), Munekawa et al.
patent: 5095404 (1992-03-01), Chao
patent: 5224030 (1993-06-01), Banks et al.
patent: 5339214 (1994-08-01), Nelson
patent: 5412535 (1995-05-01), Chao et al.
patent: 5451352 (1995-09-01), Cook
patent: 5960865 (1999-10-01), Costa et al.
patent: D419979 (2000-02-01), Lu et al.
patent: 6125035 (2000-09-01), Hood et al.
patent: 6178088 (2001-01-01), Gates
patent: 6233146 (2001-05-01), Gilchrist et al.
patent: 6304450 (2001-10-01), Dibene, II et al.
patent: 6345664 (2002-02-01), Katsui
patent: 6357515 (2002-03-01), Bhatia
patent: 6373700 (2002-04-01), Wang
patent: 6408935 (2002-06-01), DeHoff et al.
patent: 6504720 (2003-01-01), Furuya
patent: 6535386 (2003-03-01), Sathe et al.
patent: 6681487 (2004-01-01), Sagal et al.
patent: 6695041 (2004-02-01), Lai et al.
patent: 6880624 (2005-04-01), Pinneo

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Use of adjusted evaporator section area of heat pipe that is... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of adjusted evaporator section area of heat pipe that is..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of adjusted evaporator section area of heat pipe that is... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3646197

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.