Cooling body

Details Cooling body Cooling body

2006-05-30

2006-05-30

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C165S080300, C165S185000, C257S718000, C257S727000

Reexamination Certificate

active

07054158

ABSTRACT:
The present invention relates to a heat sink (1) with a main body (2) for accommodating at least one electronic structural element (5), and with a spring element (3) for pressing the structural element (5) against the main body (2), whereby the spring element (3) is held on the main body (2) by a connecting means. It is provided that the connecting means are configured as a push-on connection (15) and have a projection (7) on the main body (2) and a mounting opening (14) in the spring element (3) for the projection (7), whereby the opening edge (23) of the mounting opening (14) bears, at least in sections, against the lateral surface of the projection (7) under preload resulting from the intrinsic elasticity of the spring element (3) and/or the projection (7).

REFERENCES:
patent: 4845590 (1989-07-01), Mikolajczak
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5883783 (1999-03-01), Turturro
patent: 6046905 (2000-04-01), Nelson et al.
patent: 6049459 (2000-04-01), Edmonds et al.
patent: 6337796 (2002-01-01), Yamada et al.
patent: 6373703 (2002-04-01), Johnson et al.
patent: 6381136 (2002-04-01), Nelson et al.
patent: 6469893 (2002-10-01), Frutschy et al.
patent: 6504712 (2003-01-01), Hashimoto et al.
patent: 2001/0005312 (2001-06-01), Johnson et al.
patent: 2 163 598 (1986-02-01), None
patent: 2163598 (1986-02-01), None
Patent Abstract of Japan 06163768 A, Jun. 10, 1994.
Patent Abstract of Japan 2001332670, Nov. 22, 2001.
Patent Abstract of Japan 2001250895, Sep. 14, 2001.
Patent Abstract of Japan 9326457 A2, Dec. 16, 1997.

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