Plastic molded semiconductor package and method of manufacturing

Details Plastic molded semiconductor package and method of manufacturing Plastic molded semiconductor package and method of manufacturing

1997-11-24

2000-04-04

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438127, 438613, H01L 2144, H01L 2148, H01L 2150

Patent

active

060460717

ABSTRACT:
A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

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