Heat radiating structure for electronic device

Details Heat radiating structure for electronic device Heat radiating structure for electronic device

2006-02-28

2006-02-28

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S712000, C361S717000, C165S185000, C257S706000, C428S620000

Reexamination Certificate

active

07006354

ABSTRACT:
A heat radiating structure for an electronic device, for cooling an electronic part by transferring the heat generated in the electronic part to a heat spreader has a grading layer, which is located between the electronic part and the heat spreader and having a coefficient of thermal expansion varied such that it is substantially equal or approximate at its portion on the electronic part side to the coefficient of thermal expansion of the electronic part and such that it is substantially equal or approximate at its portion on the heat spreader side to the coefficient of thermal expansion of the heat spreader.

REFERENCES:
patent: 5132776 (1992-07-01), Hanada et al.
patent: 5981085 (1999-11-01), Ninomiya et al.
patent: 6037066 (2000-03-01), Kuwabara
patent: 6432497 (2002-08-01), Bunyan

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