Metal/ceramic bonding substrate and method for producing same

Details Metal/ceramic bonding substrate and method for producing same Metal/ceramic bonding substrate and method for producing same

2006-10-17

2006-10-17

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C257S706000, C257S712000, C257S713000, C257S720000, C257S729000, C257S730000

Reexamination Certificate

active

07122243

ABSTRACT:
There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substrate10wherein a circuit forming metal plate14is bonded to one side of a ceramic substrate12and a radiating metal base plate16is bonded to the other side thereof, at least part of the ceramic substrate12is embedded in the metal base plate16. The ceramic substrate12is arranged substantially in parallel to the metal base member16.

REFERENCES:
patent: 5157479 (1992-10-01), Sekiguchi et al.
patent: 5602720 (1997-02-01), Natsuhara et al.
patent: 5944097 (1999-08-01), Gungor et al.
patent: 6232657 (2001-05-01), Komorita et al.
patent: 6912130 (2005-06-01), Osanai et al.
patent: 6933443 (2005-08-01), Osthaus
patent: 2002-76551 (2002-03-01), None

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