Optical waveguides – Planar optical waveguide
Reexamination Certificate
2006-08-22
2006-08-22
Williams, Joseph (Department: 2879)
Optical waveguides
Planar optical waveguide
Reexamination Certificate
active
07095933
ABSTRACT:
Systems and methods for designing and fabricating multi-layer structures having thermal expansion properties are provided. One embodiment of the present invention provides a multi-layer structure. Briefly described, one such multi-layer structure comprises a central layer, a first layer, and a second layer. The first layer is constrained to a first side of the central layer and has a first thickness. The first layer comprises a first material having a first value for a thermal expansion property. The second layer is constrained to a second side of the central layer and has a second thickness. The second layer comprises a second material having a second value for a thermal expansion property. The second thickness and the second value for the thermal expansion property and the first thickness and the first value for the thermal expansion property are such that, upon a change in temperature, the net change in the strain energy in the first layer and the net change in the strain energy in the second layer are substantially equal.
REFERENCES:
patent: 4904037 (1990-02-01), Imoto et al.
patent: 5917981 (1999-06-01), Kovacic et al.
patent: 5930439 (1999-07-01), Ojha et al.
patent: 6108464 (2000-08-01), Foresi et al.
patent: 6157765 (2000-12-01), Bruce et al.
patent: 6366730 (2002-04-01), Cappuzzo et al.
patent: 6389209 (2002-05-01), Suhir
patent: 6501895 (2002-12-01), Bloechl et al.
patent: 6553170 (2003-04-01), Zhong et al.
patent: 6608947 (2003-08-01), Margalit et al.
patent: 6618537 (2003-09-01), Temkin et al.
patent: 6643441 (2003-11-01), Pafchek et al.
patent: 6768857 (2004-07-01), Bona et al.
patent: 6782177 (2004-08-01), Bona et al.
Barber, J.R., “Elasticity,” Solid Mechanics and Its Applications.
Matthys, Lieven and De Mey, Gilbert, “An Analysis of an Engineering Model for the Thermal Mismatch Stresses at the Interface of a Uniformly Heat Two Layer Structure,” The International Society for Hybrid Microelectronics.
Dong Dalei
Williams Joseph
LandOfFree
Systems and methods for designing and fabricating... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Systems and methods for designing and fabricating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for designing and fabricating... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3640944