Semiconductor device, semiconductor package for use therein,...

Details Semiconductor device, semiconductor package for use therein,... Semiconductor device, semiconductor package for use therein,...

2006-10-31

2006-10-31

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S690000

Reexamination Certificate

active

07129587

ABSTRACT:
A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin.

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