Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-06-06
2006-06-06
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C216S017000, C216S018000, C428S304400, C428S317100, C428S317300, C428S317500, C428S343000, C156S244120, C156S244250
Reexamination Certificate
active
07056406
ABSTRACT:
A porous adhesive sheet1having plural through holes2running in about parallel with each other in the thickness direction A of an adhesive organic film3, wherein the through holes have about congruent sections in the diameter direction from one opening2ato the other opening2band a production method thereof, and a semiconductor wafer with a porous adhesive sheet31, which includes a semiconductor wafer32having an electrode33, the porous adhesive sheet1adhered to the semiconductor wafer, and a conductive part34formed by filling a through hole2located on the electrode33with a conductive material, and a production method thereof are provided.
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Hotta Yuji
Yamaguchi Miho
Aftergut Jeff H.
Fischer Justin
Nitto Denko Corporation
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