Mold type semiconductor laser

Details Mold type semiconductor laser Mold type semiconductor laser

2006-06-27

2006-06-27

Harvey, Minsun Oh (Department: 2828)

Coherent light generators

Particular active media

Semiconductor

C372S036000

Reexamination Certificate

active

07068694

ABSTRACT:
A laser chip is mounted on a die pad with respective leads being secured thereto through a package. The package includes a body portion which has at least an upper mold resin portion that covers the upper face side (B) with respect to a lower face of the die pad serving as a parting line (A); and two frame side walls, which extend in a direction parallel to the laser-beam outgoing direction (C) of the laser chip, and also extend ahead of the laser chip outgoing face (D) on both sides with the laser chip interposed therebetween. Slits are formed in each of the two frame side walls not in a direction perpendicular to the outgoing direction of the laser beam, but with a predetermined angle for correcting astigmatism, and transparent plate7is secured to the slits. Consequently, it is possible to provide a semiconductor laser for use in an optical disk, which has an inexpensive structure using not a can-type structure, but a lead frame and mold resin, and is capable of positively correcting astigmatism.

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patent: 2001-284695 (2001-10-01), None

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