Semiconductor device having passivation cap and method for...

Details Semiconductor device having passivation cap and method for... Semiconductor device having passivation cap and method for...

2006-02-07

2006-02-07

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S714000

Reexamination Certificate

active

06995466

ABSTRACT:
A semiconductor device includes a semiconductor wafer having a weak portion and a removable passivation cap disposed on the wafer for covering the weak portion. The passivation cap has an absorption coefficient of a laser beam, which is smaller than that of the wafer. The cap has a capability of passing water therethrough. In a case where the device is diced and cut into a plurality of chips, the passivation cap can be removed easily without bonding the cap again. That is because the passivation cap remains one body after dicing.

REFERENCES:
patent: 5824177 (1998-10-01), Yoshihara et al.
patent: 5902499 (1999-05-01), Richerzhagen
patent: 6245593 (2001-06-01), Yoshihara et al.
patent: A-H11-251266 (1999-09-01), None
patent: A-2001-176820 (2001-06-01), None
patent: A-2002-100590 (2002-04-01), None

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