Suspension with no-solder, no-resin conductor extending...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07121840

ABSTRACT:
A resin free and solder free electrical connection in a disk drive suspension interconnect is provided including an electrical connection between conductive traces of a first metal layer and a second metal layer with a conductor pin having electrical connection with the outer surfaces of each metal layer and free of any solder and resin in making the connection.

REFERENCES:
patent: 3674914 (1972-07-01), Burr
patent: 3798419 (1974-03-01), Maake
patent: 3880486 (1975-04-01), Avakian
patent: 3964813 (1976-06-01), Pizzeck
patent: 3980367 (1976-09-01), Laserson et al.
patent: 4446505 (1984-05-01), Long et al.
patent: 4584433 (1986-04-01), Bowsky et al.
patent: 5082460 (1992-01-01), Legrady
patent: 5189261 (1993-02-01), Alexander et al.
patent: 5239135 (1993-08-01), Phillips, II
patent: 5952716 (1999-09-01), Dibble et al.
patent: 6205003 (2001-03-01), Iwamoto
patent: 6382988 (2002-05-01), Rugg et al.
patent: 6411516 (2002-06-01), Palumbo et al.
patent: 6515832 (2003-02-01), Girard
patent: 6636383 (2003-10-01), Chew
patent: 6647621 (2003-11-01), Roen et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Suspension with no-solder, no-resin conductor extending... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Suspension with no-solder, no-resin conductor extending..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Suspension with no-solder, no-resin conductor extending... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3638647

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.