Process for the production of high-density printed wiring board

Details Process for the production of high-density printed wiring board Process for the production of high-density printed wiring board

2006-11-28

2006-11-28

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C427S097100, C427S099300

Reexamination Certificate

active

07140103

ABSTRACT:
Process for producing a high-density printed wiring board, comprising:providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 μm thickness,forming an electrolytic copper plating layer of 0.5 to 3 μm thickness using the electroless copper plating layer as electrode,forming a plating resist layer on a portion of the copper plating layer,forming a pattern copper plating layer of 6 to 30 μm thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating,removing the plating resist layer, andetching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.

REFERENCES:
patent: 5372914 (1994-12-01), Naito et al.
patent: 6240636 (2001-06-01), Asai et al.
patent: 6570098 (2003-05-01), Shimizu et al.
patent: 6671949 (2004-01-01), Yoshioka et al.
patent: 6708404 (2004-03-01), Gaku et al.

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