Method for fabricating a substrate, including a plurality of...

Details Method for fabricating a substrate, including a plurality of... Method for fabricating a substrate, including a plurality of...

2006-10-10

2006-10-10

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000, C029S852000, C174S255000, C174S262000, C257S433000, C438S108000

Reexamination Certificate

active

07117587

ABSTRACT:
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-layer rigid PCB. A portion of the multi-layer rigid PCB between the grooves is milled to expose a corresponding portion of the soft PCB to define an exposed area. The combined PCB is drilled through along two opposite sides of the grooves and the corresponding exposed area of the soft PCB. Breakable parts are formed at a center of the corresponding portion of the soft PCB and two opposite outside edges of the grooves.

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