Method of forming a feature having a high aspect ratio

Details Method of forming a feature having a high aspect ratio Method of forming a feature having a high aspect ratio

2006-08-08

2006-08-08

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603120, C029S603130, C430S314000, C205S667000, C360S119050, C360S122000, C427S098300, C427S132000

Reexamination Certificate

active

07086138

ABSTRACT:
A method for forming high aspect ratio metallization on a wafer is implemented in the formation of a disc drive recording head. The process involves patterning photoresist where metal is to be later deposited, milling around the photoresist perimeter, depositing insulating material in the milled region, around and over the photoresist, then dissolving the photoresist to be replaced with metal. The process features the ability to desirably increase the aspect ratio of height to width of a metallization on a wafer. An improved aspect ratio can be utilized to improve the quality of a write pole in a recording head, effectively increasing its achievable recording density.

REFERENCES:
patent: 6018862 (2000-02-01), Stageberg et al.
patent: 6024886 (2000-02-01), Han et al.
patent: 6218080 (2001-04-01), Wu et al.
patent: 3-125308 (1981-05-01), None
Yoda et al, “Self-Alignment Trench-Pole Writer”, IEEE Transactions on Magnetics, vol. 35, Issue 5, pp. 2535-2537, Sep. 1999.

Affiliated with

Also associated with

Rating

Method of forming a feature having a high aspect ratio does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a feature having a high aspect ratio, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a feature having a high aspect ratio will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3634406