Micromachined fluidic device and method for making same

Details Micromachined fluidic device and method for making same Micromachined fluidic device and method for making same

2006-02-28

2006-02-28

Vinh, Lan (Department: 1765)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S095000, C438S052000, C438S053000, C438S745000

Reexamination Certificate

active

07005078

ABSTRACT:
The fluid-flow device (100) of the invention comprises a stack (30) covered by a closure wafer (20), said stack (30) comprising a support wafer (36), a layer of insulating material (34), and a silicon layer (32). The closure wafer (20) and/or said silicon layer (32) are machined so as to define a cavity (38) between said closure wafer (20) and said silicon layer (32), said support wafer (36) has at least one duct (102) passing right through it, said layer of insulating material (34) presenting at least one zone (35) that is entirely free of material placed at least in line with said duct (102) so as to co-operate with said cavity (38) to define a moving member (40) in said silicon layer (32), the moving member being suitable under the pressure of liquid in said cavity (38) for reversibly moving towards said support wafer (36) until contact is made between said moving member (40) and said support wafer (36).

REFERENCES:
patent: 6069392 (2000-05-01), Tai et al.
patent: 6116863 (2000-09-01), Ahn et al.
patent: 6596545 (2003-07-01), Wagner et al.
patent: 0483469 (1991-08-01), None
patent: 0568902 (1993-04-01), None
patent: WO 95/18307 (1995-07-01), None
patent: WO 97/29538 (1997-08-01), None
Peter Gravesen, Jens Branebjerg and Ole Sondergard Jensen, “Microfluidics-a review,” IOP Publishing Ltd. (United Kingdom), p. 168-182, (Jan. 30, 1993).

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