Method for combining via patterns into a single mask

Details Method for combining via patterns into a single mask Method for combining via patterns into a single mask

2006-08-08

2006-08-08

Rosasco, S. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

Reexamination Certificate

active

07087350

ABSTRACT:
In a damascene process of fabricating an interconnect structure in an integrated circuit, a method for removing separate via layers is disclosed herein, which includes combining the via layers into a single mask.

REFERENCES:
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patent: 5675187 (1997-10-01), Numata et al.
patent: 6109775 (2000-08-01), Tripathi et al.
patent: 6355563 (2002-03-01), Cha et al.
patent: 6487712 (2002-11-01), Kim
patent: 6492259 (2002-12-01), Dirahoui et al.
patent: 2003/0044059 (2003-03-01), Chang et al.

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