Semiconductor device, semiconductor package, electronic...

Details Semiconductor device, semiconductor package, electronic... Semiconductor device, semiconductor package, electronic...

2006-08-15

2006-08-15

Mai, Anh D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257S778000, C257S747000, C257S775000

Reexamination Certificate

active

07091619

ABSTRACT:
A method is provided to enhance the connection reliability in three-dimensional mounting while considering the warping of packages. Opening diameters of the openings provided corresponding to protruding electrodes, respectively, are set so as to gradually decrease from the central portion toward the outer peripheral portion of a carrier substrate, and the opening diameters of openings provided corresponding to the protruding electrodes, respectively, are set so as to gradually decrease from the central portion toward the outer peripheral portion of another carrier substrate.

REFERENCES:
patent: 3871015 (1975-03-01), Lin et al.
patent: 5120678 (1992-06-01), Moore et al.
patent: 5222014 (1993-06-01), Lin
patent: 5432358 (1995-07-01), Nelson et al.
patent: 5569960 (1996-10-01), Kumazawa et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5755374 (1998-05-01), Prigmore
patent: 5796169 (1998-08-01), Dockerty et al.
patent: 5834848 (1998-11-01), Iwasaki
patent: 5940729 (1999-08-01), Downes et al.
patent: 5973392 (1999-10-01), Senba et al.
patent: 6020561 (2000-02-01), Ishida et al.
patent: 6023097 (2000-02-01), Chiang et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 6034425 (2000-03-01), Chiang et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6121689 (2000-09-01), Capote et al.
patent: 6122171 (2000-09-01), Akram et al.
patent: 6184586 (2001-02-01), Matsushima
patent: 6239383 (2001-05-01), Lin
patent: 6288445 (2001-09-01), Kimura
patent: 6369444 (2002-04-01), Degani et al.
patent: 6369448 (2002-04-01), McCormick
patent: 6396116 (2002-05-01), Kelly et al.
patent: 6404049 (2002-06-01), Shibamoto et al.
patent: 6442026 (2002-08-01), Yamaoka
patent: 6444563 (2002-09-01), Potter et al.
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6489678 (2002-12-01), Joshi
patent: 6493229 (2002-12-01), Akram et al.
patent: 6507098 (2003-01-01), Lo et al.
patent: 6563712 (2003-05-01), Akram et al.
patent: 6573119 (2003-06-01), Hirashima et al.
patent: 6586684 (2003-07-01), Frutschy et al.
patent: 6586832 (2003-07-01), Shibata et al.
patent: 6611063 (2003-08-01), Ichinose et al.
patent: 6627991 (2003-09-01), Joshi
patent: 6633078 (2003-10-01), Hamaguchi et al.
patent: 6654250 (2003-11-01), Alcoe
patent: 6670264 (2003-12-01), Sakuyama et al.
patent: 6707161 (2004-03-01), Moon et al.
patent: 6731009 (2004-05-01), Jones et al.
patent: 6736306 (2004-05-01), Byun et al.
patent: 6750549 (2004-06-01), Chandran et al.
patent: 6774467 (2004-08-01), Horiuchi et al.
patent: 6774473 (2004-08-01), Shen
patent: 6781241 (2004-08-01), Nishimura et al.
patent: 6787916 (2004-09-01), Halahan
patent: 6870272 (2005-03-01), Kovac et al.
patent: 6882232 (2005-04-01), Harima
patent: 6903458 (2005-06-01), Nathan
patent: 6905911 (2005-06-01), Hamaguchi et al.
patent: 2001/0015488 (2001-08-01), Akram et al.
patent: 2002/0017709 (2002-02-01), Yanagisawa et al.
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 2002/0117330 (2002-08-01), Eldridge et al.
patent: 2003/0022465 (2003-01-01), Wachtler
patent: 2003/0067064 (2003-04-01), Kim
patent: 2003/0122240 (2003-07-01), Lin et al.
patent: 2004/0135243 (2004-07-01), Aoyagi
patent: 2004/0222510 (2004-11-01), Aoyagi
patent: 2004/0238954 (2004-12-01), Miyaji et al.
patent: 2004/0262368 (2004-12-01), Haw et al.
patent: 06-013541 (1994-01-01), None
patent: 07-183426 (1995-07-01), None
patent: 09-2685 (1997-04-01), None
patent: 09-283697 (1997-10-01), None
patent: 10-084076 (1998-03-01), None
patent: 10-340928 (1998-12-01), None
patent: 11-307717 (1999-11-01), None
patent: 2000-040713 (2000-02-01), None
patent: 2001-015633 (2001-01-01), None
patent: 2001-110979 (2001-04-01), None
patent: 2001-223297 (2001-08-01), None
patent: 2002-057273 (2002-02-01), None
patent: 2002-134661 (2002-05-01), None
patent: 2002-329813 (2002-11-01), None
patent: 2002-353272 (2002-12-01), None
patent: 2004-079923 (2004-03-01), None
patent: 2004-265955 (2004-09-01), None
patent: 2004-273938 (2004-09-01), None
US 6,120,855, 09/2000, Call et al. (withdrawn)
Communication from Japanese Patent Office re: related application.

Affiliated with

Also associated with

Rating

Semiconductor device, semiconductor package, electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, semiconductor package, electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, semiconductor package, electronic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3626971