Method for fabricating a metal-insulator-metal capacitor in...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C438S622000

Reexamination Certificate

active

07067921

ABSTRACT:
A method of fabricating a metal-insulator-metal capacitor in a semiconductor device is disclosed. An example method for fabricating an MIM capacitor of a semiconductor device deposits a metal layer to be used as a lower electrode of an MIM capacitor, deposits a sacrificial layer on the metal layer, and removes some part of the sacrificial layer to form the MIM capacitor thereon. In addition, the example method deposits a dielectric layer and an upper metal layer and forms the MIM capacitor by patterning the dielectric layer and the upper metal layer.

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patent: 2004/0152256 (2004-08-01), Noguchi et al.
patent: 10-1998-0034728 (1998-08-01), None
patent: 10-2001-00013685 (2001-03-01), None
patent: 10-2001-0088733 (2001-12-01), None
Olewine et al., Publication No. US 2003/0067023, Apr. 10, 2003.

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