Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-08-08
2006-08-08
Baumeister, Bradley W. (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C372S011000, C372S070000
Reexamination Certificate
active
07087447
ABSTRACT:
A method for batch manufacturing of slabs for zig-zag lasers including steps of bonding two non-active media to either side of an active medium to form a sandwich, dicing the sandwich to provide slices, rendering two surfaces of each slice into total-internal-reflection (TIR) surfaces, and then dicing the slices perpendicular to the TIR surfaces to provide a plurality of zig-zag slabs.
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Byer Robert L.
Saraf Shailendhar
Sridharan Arun Kumar
Baumeister Bradley W.
Lumen Intellectual Property Services Inc.
Reames Matthew L.
The Board of Trustees of the Leland Stanford Junior University
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