Socket grid array

Details Socket grid array Socket grid array

2006-02-28

2006-02-28

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257S778000

Reexamination Certificate

active

07005742

ABSTRACT:
Assembly methods and semiconductor device assemblies are disclosed in which corresponding IC sockets and PCB projections are used for alignment and bond formation between IC and PCB components of a completed assembly, for example, a BGA. Embodiments of the invention further provide the capability of disassembly and reassembly.

REFERENCES:
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5628919 (1997-05-01), Tomura et al.
patent: 5956606 (1999-09-01), Burnette
patent: 6624512 (2003-09-01), Kurusu
patent: 2325354 (1998-11-01), None

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