Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-06-27
2006-06-27
Cuneo, Kamand (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C174S262000, C257S778000, C257S786000
Reexamination Certificate
active
07067741
ABSTRACT:
A semiconductor device includes a semiconductor chip and a substrate having an interconnecting pattern formed thereover. The substrate has the semiconductor chip mounted on one surface thereof. The substrate has an outline larger than the semiconductor chip. First terminals are formed in a region outside the region of the substrate in which the semiconductor chip is mounted. Second terminals are a part of the interconnecting pattern which exposes its surface opposite to its surface opposing the semiconductor chip in a region closer to a center of the substrate than the first terminals. The semiconductor chip is electrically connected to the first and second terminals.
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Cuneo Kamand
Oliff & Berridg,e PLC
Patel Ishwar (I. B).
Seiko Epson Corporation
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