Multi-chip integrated circuit module for high-frequency...

Details Multi-chip integrated circuit module for high-frequency... Multi-chip integrated circuit module for high-frequency...

2006-10-17

2006-10-17

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S678000, C257S666000

Reexamination Certificate

active

07122892

ABSTRACT:
A multi-chip electronic module comprises a multiplicity of integrated circuit chips arranged in a vertical stack. Each chip includes at least one first electrical terminal, with at least a first subset of the first terminals being disposed at different heights relative to the stack. A multiplicity of second electrical terminals is disposed on a support member, and a multiplicity of first electrical conductors (e.g., wirebonds) is connected between the first subset and at least a second subset of the second terminals. In order to reduce the skew produced at relatively high frequencies, all of the first conductors have substantially the same inductive impedance at the frequency of operation of the module. Our invention is particularly well suited to modules that operate at frequencies of about 500 MHz or higher.

REFERENCES:
patent: 4801765 (1989-01-01), Moyer et al.
patent: RE36894 (2000-10-01), Greenberg et al.
patent: 6437449 (2002-08-01), Foster
patent: 6700206 (2004-03-01), Kinsman
patent: 6879037 (2005-04-01), Wada et al.
patent: 2004/0113254 (2004-06-01), Karnezos
Leroys Engineering Website: IC Pack Types, Logic Design Information, found at http://interfacebus.com;Design—Pack—types.html, pp. 1-3 (Sep. 29, 2004).

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