Process for electroless plating using separate sensitization and

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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427306, 427 98, C23C 302

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active

040427307

ABSTRACT:
A process is described for the electroless deposition of metals on nonmetallic surfaces. After pretreatment of the nonmetallic surface so as to obtain a finish suitable for deposition of sensitizers and activators, the nonmetallic surface is exposed to a sensitizing solution and thereafter in a separate step to an activation solution. The surface is then washed with an aqueous alkaline solution prior to immersion in the electroless plating solution. The separate sensitization and activation steps are particularly suitable where the sensitizing step is also used for pattern generation. The inclusion of the aqueous alkaline wash after the activation step both protects the electroless plating bath from contamination with sensitizer and activator, and also insures a short initition time. Short initiation times are highly desirable especially in the production of electronic circuits because highly uniform metal platings are insured, manufacturing time is considerably reduced and reliability is increased.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley
patent: 3674550 (1972-07-01), Mallory
patent: 3694250 (1972-09-01), Grunwald et al.
Goldie, Metallic Coating of Plastics, Electrochemical Pub. Ltd., 1968, vol. 1, Chapter 5.
McDermott, Plating of Plastics with Metals, Noyes Data Corp., 1974, Chapter 1.
Journal of Electrochemical Soc., vol. 122, p. 1478, 1975, vol. 120, p. 1241, 1973.
Lowenheim, Moder Electroplating, 3rd Ed., 1974, p. 645.

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