Combined chip/heat-dissipating metal plate and method for...

Details Combined chip/heat-dissipating metal plate and method for... Combined chip/heat-dissipating metal plate and method for...

2006-10-24

2006-10-24

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S707000, C361S709000, C361S711000, C029S592100, C029S825000, C029S832000, C029S835000, C029S844000, C029S861000, C165S080300, C165S185000, C257S706000, C257S707000, C438S015000, C438S458000

Reexamination Certificate

active

07126825

ABSTRACT:
A combined chip/heat-dissipating metal plate includes a chip and a heat-dissipating metal plate bonded to a side of the chip, wherein the heat-dissipating metal plate is in a stretched state. The heat-dissipating metal plate is stretched before bonding the chip. Preferably, the stretched heat-dissipating metal plate has a thickness smaller than that of the heat-dissipating metal plate before stretching by not more than 20%. The chip has good compression strength in the radial direction and the heat-dissipating metal plate has higher tensile strength after being stretched and taking shape, providing a more stable structure and avoiding damage to the chip due to radially outward tension. The combined chip/heat-dissipating metal plate thus obtained is more stable and thus benefits the subsequent cutting by a laser cutting apparatus.

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