Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2006-06-06
2006-06-06
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S777000, C257S784000, C257S666000
Reexamination Certificate
active
07057281
ABSTRACT:
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
REFERENCES:
patent: 4968315 (1990-11-01), Gatturna
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5145099 (1992-09-01), Wood et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5296744 (1994-03-01), Liang et al.
patent: 5311057 (1994-05-01), McShane
patent: 5359227 (1994-10-01), Liang et al.
patent: 5518957 (1996-05-01), Kim
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5696033 (1997-12-01), Kinsman
patent: 5714800 (1998-02-01), Thompson
patent: 5735030 (1998-04-01), Orcutt
patent: 5739585 (1998-04-01), Akram et al.
patent: D394844 (1998-06-01), Farnworth et al.
patent: 5826628 (1998-10-01), Hamilton
patent: 5834831 (1998-11-01), Kubota et al.
patent: D402638 (1998-12-01), Farnworth et al.
patent: 5851845 (1998-12-01), Wood et al.
patent: 5879965 (1999-03-01), Jiang et al.
patent: 5883426 (1999-03-01), Tokuno et al.
patent: 5891753 (1999-04-01), Akram
patent: 5893726 (1999-04-01), Farnworth et al.
patent: 5898224 (1999-04-01), Akram
patent: 5933713 (1999-08-01), Farnworth
patent: 5938956 (1999-08-01), Hembree et al.
patent: 5946553 (1999-08-01), Wood et al.
patent: 5958100 (1999-09-01), Farnworth et al.
patent: 5986209 (1999-11-01), Tandy
patent: 5989941 (1999-11-01), Wensel
patent: 5990566 (1999-11-01), Farnworth et al.
patent: 5994784 (1999-11-01), Ahmad
patent: RE36469 (1999-12-01), Wood et al.
patent: 6008070 (1999-12-01), Farnworth
patent: 6008074 (1999-12-01), Brand
patent: 6020624 (2000-02-01), Wood et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6028365 (2000-02-01), Akram et al.
patent: 6046496 (2000-04-01), Corisis et al.
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6049125 (2000-04-01), Brooks et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6075288 (2000-06-01), Akram
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6103547 (2000-08-01), Corisis et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6107680 (2000-08-01), Hodges
patent: 6117382 (2000-09-01), Thummel
patent: 6124634 (2000-09-01), Akram et al.
patent: 6130474 (2000-10-01), Corisis
patent: 6133068 (2000-10-01), Kinsman
patent: 6133622 (2000-10-01), Corisis et al.
patent: 6137162 (2000-10-01), Park et al.
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6150710 (2000-11-01), Corisis
patent: 6150717 (2000-11-01), Wood et al.
patent: 6153924 (2000-11-01), Kinsman
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6175149 (2001-01-01), Akram
patent: 6176416 (2001-01-01), Tsai et al.
patent: 6184465 (2001-02-01), Corisis
patent: 6198172 (2001-03-01), King et al.
patent: 6208519 (2001-03-01), Jiang et al.
patent: 6210992 (2001-04-01), Tandy et al.
patent: 6212767 (2001-04-01), Tandy
patent: 6215175 (2001-04-01), Kinsman
patent: 6225689 (2001-05-01), Moden et al.
patent: 6228548 (2001-05-01), King et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6235554 (2001-05-01), Akram et al.
patent: 6239489 (2001-05-01), Jiang
patent: 6246108 (2001-06-01), Corisis et al.
patent: 6246110 (2001-06-01), Kinsman et al.
patent: 6252308 (2001-06-01), Akram et al.
patent: 6255720 (2001-07-01), Courtenay
patent: 6258623 (2001-07-01), Moden et al.
patent: 6258624 (2001-07-01), Corisis
patent: 6259153 (2001-07-01), Corisis
patent: 6261865 (2001-07-01), Akram
patent: 6271580 (2001-08-01), Corisis
patent: 6277671 (2001-08-01), Tripard
patent: 6281577 (2001-08-01), Oppermann et al.
patent: 6284571 (2001-09-01), Corisis et al.
patent: 6291894 (2001-09-01), Farnworth et al.
patent: 6294839 (2001-09-01), Mess et al.
patent: 6297547 (2001-10-01), Akram
patent: 6303981 (2001-10-01), Moden
patent: 6303985 (2001-10-01), Larson et al.
patent: 6310390 (2001-10-01), Moden
patent: 6314639 (2001-11-01), Corisis
patent: 6316285 (2001-11-01), Jiang et al.
patent: 6326242 (2001-12-01), Brooks et al.
patent: 6326244 (2001-12-01), Brooks et al.
patent: 6326687 (2001-12-01), Corisis
patent: 6326697 (2001-12-01), Farnworth
patent: 6326698 (2001-12-01), Akram
patent: 6329220 (2001-12-01), Bolken et al.
patent: 6329705 (2001-12-01), Ahmad
patent: 6331221 (2001-12-01), Cobbley
patent: 6331448 (2001-12-01), Ahmad
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6332766 (2001-12-01), Thummel
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6365434 (2002-04-01), Rumsey et al.
patent: 6420782 (2002-07-01), Eng et al.
patent: 6429528 (2002-08-01), King et al.
patent: 6441501 (2002-08-01), Tseng et al.
patent: 6451709 (2002-09-01), Hembree
patent: 6521993 (2003-02-01), Masayuki et al.
patent: 6548376 (2003-04-01), Jiang
patent: 6548757 (2003-04-01), Russell et al.
patent: 6552910 (2003-04-01), Moon et al.
patent: 6558600 (2003-05-01), Williams et al.
patent: 6560117 (2003-05-01), Moon
patent: 6561479 (2003-05-01), Eldridge
patent: 6564979 (2003-05-01), Savaria
patent: 6576494 (2003-06-01), Farnworth
patent: 6576495 (2003-06-01), Jiang et al.
patent: 6589820 (2003-07-01), Bolken
patent: 6590281 (2003-07-01), Wu et al.
patent: 6607937 (2003-08-01), Corisis
patent: 6614092 (2003-09-01), Eldridge et al.
patent: 6622380 (2003-09-01), Grigg
patent: 6638595 (2003-10-01), Rumsey et al.
patent: 6644949 (2003-11-01), Rumsey et al.
patent: 6653173 (2003-11-01), Bolken
patent: 6656769 (2003-12-01), Lee et al.
patent: 6661104 (2003-12-01), Jiang et al.
patent: 6664139 (2003-12-01), Bolken
patent: 6670719 (2003-12-01), Eldridge et al.
patent: 6672325 (2004-01-01), Eldridge
patent: 6673649 (2004-01-01), Hiatt et al.
patent: 2001/0050417 (2001-12-01), Courtenay
patent: 2003/0127712 (2003-07-01), Murakami et al.
patent: 2003/0205801 (2003-11-01), Baik et al.
patent: 0 753 891 (1997-01-01), None
patent: 0 240 433 (1997-10-01), None
patent: 0 849 794 (1998-06-01), None
patent: 0 204 102 (1986-12-01), None
patent: 01309357 (1989-12-01), None
patent: WO 02/082527 (2002-10-01), None
Hmiel, A. F. et al., “A Novel Process for Protecting Wire Bonds From Sweep During Molding”, 8 pages, International Electronics Manufacturing Technology Symposium, Jul. 17-18, 2002, IEEE.
Chylak, B. et al., “Overcoming the Key Barriers in 35 μm Pitch Wire Bond Packaging: Probe, Mold, and Substrate Solutions and Trade-offs”, 6 pages, International Electronics Manufacturing Technology Symposium, Jul. 17-18, 2002, IEEE.
Kulicke & Soffa, NoSWEEP® Wire Bond Encapsulant, 1 page, retrieved from the Internet on Jan. 2, 2003, <http://www.kns.com/prodserv/Polymers/NoSweep.asp>.
Chuan Tan Hock
Chye Chew Beng
Ming David Chai Yih
Peng Neo Chee
Shing Michael Tan Kian
Micro)n Technology, Inc.
Perkins Coie LLP
Weiss Howard
LandOfFree
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