Mask for projecting a structure pattern onto a semiconductor...

Details Mask for projecting a structure pattern onto a semiconductor... Mask for projecting a structure pattern onto a semiconductor...

2006-06-06

2006-06-06

Rosasco, S. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

Reexamination Certificate

active

07056628

ABSTRACT:
A mask is configured for projecting a structure pattern onto a semiconductor substrate in an exposure unit. The exposure unit has a minimum resolution limit for projecting the structure pattern onto the semiconductor substrate. The mask has a substrate, at least one raised first structure element on the substrate which has a lateral extent which is at least the minimum lateral extent that can be attained by the exposure unit, a configuration second raised structure elements which are arranged in an area surrounding the at least one first structure element on the substrate in the form of a matrix with a row spacing and a column spacing, whose shape and size are essentially identical to one another, and which have a respective lateral extent that is less than the minimum resolution limit of the exposure unit.

REFERENCES:
patent: 5242770 (1993-09-01), Chen et al.
patent: 6197452 (2001-03-01), Matumoto
patent: 6569584 (2003-05-01), Ho et al.
patent: 6839890 (2005-01-01), Sugita et al.

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