Process for manufacturing a circuit board

Details Process for manufacturing a circuit board Process for manufacturing a circuit board

2006-09-12

2006-09-12

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S848000, C029S849000, C174S250000, C174S254000, C174S255000, C427S154000, C427S355000, C428S209000, C428S413000

Reexamination Certificate

active

07103971

ABSTRACT:
A compression function layer60is provided on at least one board surface. The compression function layer60adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board10which includes this layer. Thereby a sufficient pressure is applied to conductors14.

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