Method of producing a helical coil chip

Details Method of producing a helical coil chip Method of producing a helical coil chip

2006-05-09

2006-05-09

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S601000, C029S602100, C029S605000, C029S606000, C029S830000, C029S846000, C336S200000, C336S223000, C336S232000

Reexamination Certificate

active

07040014

ABSTRACT:
An object of the present invention is to provide a coil chip having a structure with which downsizing of the coil chip can be realized and a high inductance and a high Q can be obtained and to provide a method of producing such a coil chip. In order to attain the object, according to the present invention, there is provided a coil structure including a core member made of a material having low dielectric loss characteristics, a coil formed by metal plating and wound around the core member, and a layer functioning as a seed for metal plating provided between the core member and the coil.

REFERENCES:
patent: 6449830 (2002-09-01), Amada et al.
patent: 6686824 (2004-02-01), Yamamoto
patent: 1117655 (1996-02-01), None
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patent: 10-241943 (1998-09-01), None
patent: 11-204362 (1999-07-01), None
patent: 11-283834 (1999-10-01), None
patent: 2000-252127 (2000-09-01), None

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