Process for producing a multi-layer printed wiring board

Details Process for producing a multi-layer printed wiring board Process for producing a multi-layer printed wiring board

2006-10-31

2006-10-31

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S593000, C029S610100, C029S612000, C029S830000, C029S846000, C029S847000, C156S089180, C174S255000, C174S256000, C219S121680, C219S121690, C427S097200, C427S097500

Reexamination Certificate

active

07127812

ABSTRACT:
A board20is provided with a Cu film30as a conformal mask, in which are formed a register mark30band an opening3athrough which a via hole is formed. A camera senses this register mark30bso that the position of the board30is determined. A laser beam is directed to the approximate position of the opening30a, so that the opening26athrough which the via hole is drilled is formed. The accuracy of the position of the opening of the via hole depends on the accuracy of the position of the opening30ain the Cu film30as the conformal mask. Therefore, the via hole can be formed at an adequate position despite the low accuracy of the position for laser irradiation.

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