Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-03-21
2006-03-21
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S839000, C029S840000, C029S842000, C228S180210, C438S106000, C257S734000
Reexamination Certificate
active
07013557
ABSTRACT:
A method of packaging an electronic component having electrodes soldered on lands on a printed circuit board uses a mask pattern that corresponds to the lands onto which solder paste is deposited. Solder paste is printed on the lands using the mask which has a convex shape such that the edges of the solder paste lie inside the edges of the lands. The electrodes are then placed on the solder paste, and the solder paste is caused to reflow to solder the electrodes to the lands.
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Igarashi Makoto
Sakai Hiroshi
Suzuki Motoji
Tanaka Akihiro
Foley & Lardner LLP
NEC Corporation
Trinh Minh
LandOfFree
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