Hybrid integrated circuit device

Details Hybrid integrated circuit device Hybrid integrated circuit device

2006-07-18

2006-07-18

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S701000, C257SE23003

Reexamination Certificate

active

07078797

ABSTRACT:
Provided is a hybrid integrated circuit device which can more effectively stabilize a circuit configured to operate at a high speed. A hybrid integrated circuit device of the embodiment includes a metal substrate provided with an insulating layer on a surface thereof, a conductive pattern formed on a surface of the insulating layer, a semiconductor element fixed onto the conductive pattern, a lead as external connecting means fixed to the conductive pattern in the periphery of the metal substrate, and a contact portion for electrically connecting the conductive pattern electrically connected to the semiconductor element to the metal substrate in the vicinity of the semiconductor element.

REFERENCES:
patent: 5321299 (1994-06-01), Ohkawa et al.
patent: 6351026 (2002-02-01), Hirasawa et al.
patent: 6373705 (2002-04-01), Koelle et al.

Affiliated with

Also associated with

Rating

Hybrid integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hybrid integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid integrated circuit device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3608762