Polishing apparatus

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S006000, C451S008000, C451S041000, C451S285000, C451S286000, C451S287000, C451S288000

Reexamination Certificate

active

07101255

ABSTRACT:
This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein the polishing surface of the secondary polishing table is constructed to be arranged such that at least a portion of a surface of the workpiece being polished by the polishing surface of the secondary polishing table extends beyond an edge of the polishing surface of the secondary polishing table. Also provided is a film thickness measuring device, which measures the thickness of a film formed on a polished workpiece while the polished workpiece is held by a top ring above a pusher.

REFERENCES:
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5442416 (1995-08-01), Tateyama et al.
patent: 5542874 (1996-08-01), Chikaki
patent: 5551986 (1996-09-01), Jain
patent: 5554064 (1996-09-01), Breivogel et al.
patent: 5616063 (1997-04-01), Okumura et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5695564 (1997-12-01), Imahashi
patent: 5711818 (1998-01-01), Jain
patent: 5738563 (1998-04-01), Shibata
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5830045 (1998-11-01), Togawa et al.
patent: 5893795 (1999-04-01), Perlov et al.
patent: 5899792 (1999-05-01), Yagi
patent: 6036582 (2000-03-01), Aizawa et al.
patent: 6116994 (2000-09-01), Ito et al.
patent: 6136715 (2000-10-01), Shendon et al.
patent: 6220945 (2001-04-01), Hirokawa et al.
patent: 6312312 (2001-11-01), Togawa et al.
patent: 6413145 (2002-07-01), Pinson, II et al.
patent: 6595831 (2003-07-01), Hirokawa et al.
patent: 6776692 (2004-08-01), Zuniga et al.
patent: 0761387 (1997-03-01), None
patent: 0807492 (1997-03-01), None
patent: 2 301 544 (1996-12-01), None
patent: 1-268032 (1989-10-01), None
patent: 3-211749 (1991-09-01), None
Patent Abstracts Of Japan, vol. 098, No. 001, Jan. 30, 1998 & JP 09 225815 A (Sony Corp), Sep. 2, 1997—see abstract.
Patent Abstracts of Japan, vol. 096, No. 008, Aug. 30, 1996 & JP 08 111449 (Tokyo Electron LTD.) Apr. 30, 1996, See abstract & US 5 695 564 A (IMAHASHI), See Col. 4, line 52-line 58; Figure 1.
Patent Abstracts of Japan, vol. 095, No. 008, Sep. 29, 1995 & JP 07 135192 A (Sony Corp.), May 23, 1995—See abstract.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3607808

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.