Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-04-04
2006-04-04
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S758000
Reexamination Certificate
active
07023080
ABSTRACT:
A semiconductor integrated circuit includes a plurality of layers provided on a semiconductor substrate, wires provided in a first layer that is one of the plurality of layers, and wire dummies provided in a second layer different from the first layer and having an arrangement that avoids areas overlapping positions of the wires.
REFERENCES:
patent: 5032890 (1991-07-01), Ushiku et al.
patent: 5308682 (1994-05-01), Morikawa
patent: 5404045 (1995-04-01), Mizushima
patent: 5441915 (1995-08-01), Lee
patent: 5534728 (1996-07-01), Kim et al.
patent: 5589706 (1996-12-01), Mitwalsky et al.
patent: 5894168 (1999-04-01), Michael et al.
patent: 6020616 (2000-02-01), Bothra et al.
patent: 6069067 (2000-05-01), Kinugawa
patent: 6384464 (2002-05-01), Shin
patent: 6396158 (2002-05-01), Travis et al.
patent: 6399897 (2002-06-01), Umematsu et al.
patent: 10-27799 (1998-01-01), None
patent: 11-040672 (1999-02-01), None
Office Action from Japanese Patent Office dated Jun. 21, 2005, for Japanese Patent Application No. 2001-322814.
Kenji Hashimoto
Ozawa Hiroyuki
Yamauchi Hideaki
Clark S. V.
Fujitsu Limited
Westerman Hattori Daniels & Adrian LLP
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