Method for cleaning semiconductor wafers

Details Method for cleaning semiconductor wafers Method for cleaning semiconductor wafers

2006-04-18

2006-04-18

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S054000, C422S186300, C502S242000, C502S227000, C134S001300, C438S678000

Reexamination Certificate

active

07029374

ABSTRACT:
A method for cleaning a surface of semiconductor wafer after chemical mechanical polishing in accordance with the present invention comprises the steps of: (1) providing a semiconductor wafer having a surface to be treated; (2) applying a photocatalyst containing solution to the surface, the solution having a plurality of photocatalyst particles; and (3) applying light to the surface, the light being adapted to activate the photocatalyst particles.

REFERENCES:
patent: 6364744 (2002-04-01), Merchant et al.
patent: 6435947 (2002-08-01), Mueller et al.
patent: 6537381 (2003-03-01), Mikhaylich et al.
patent: 6541434 (2003-04-01), Wang
patent: 6624070 (2003-09-01), Merricks et al.
patent: 411023838 (1999-01-01), None

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