High density patching system with longframe jacks

Details High density patching system with longframe jacks High density patching system with longframe jacks

2006-05-16

2006-05-16

Prasad, Chandrika (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

C439S188000

Reexamination Certificate

active

07044803

ABSTRACT:
A patching system is disclosed herein. The patching system includes a plurality of front-loaded patching modules positionable within a chassis. Each of the patching modules includes first and second longframe jack assemblies and a switch for changing the circuit configurations of the patching module. The patching modules and the chassis provide increased patching density.

REFERENCES:
patent: 5582525 (1996-12-01), Louwagie et al.
patent: 5879197 (1999-03-01), Dewey
patent: 6116961 (2000-09-01), Henneberger et al.
patent: 6535367 (2003-03-01), Carpenter et al.
patent: 6540562 (2003-04-01), Baker et al.
patent: 2002/0173188 (2002-11-01), Follingstad et al.
patent: 2004/0067671 (2004-04-01), Eckhart
patent: 2004/0077220 (2004-04-01), Musolf et al.

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