Method of making a multilayer wiring board

Details Method of making a multilayer wiring board Method of making a multilayer wiring board

2006-05-23

2006-05-23

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S840000

Reexamination Certificate

active

07047634

ABSTRACT:
A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame resin layer includes at least one of glass cloth, filler and nonwoven fabric. The frame resin layer includes no electronic component.

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