Socket apparatus for IC packages

Details Socket apparatus for IC packages Socket apparatus for IC packages

1997-11-17

2000-04-04

Vu, Hien

Electrical connectors

Coupling part having handle or means to move contact...

439331, H01R 1122

Patent

active

060453826

ABSTRACT:
An IC seating portion (14) of a socket (2) for a semiconductor device (300) is arranged so that the IC terminal leads can engage with contact heads (22) of contact pins (20) mounted in the socket. Each contact pin (20) is arranged in a respective slit (8) formed by partition members (7) providing electrically isolation of the contact pins from one another. Socket (2) has a blocking member (3) which blocks the gaps or slits at their top to prevent IC terminal leads from becoming entangled with the slits or contact pins (20). A stop member (4) is formed in the IC seating portion (14) to facilitate positioning of a semiconductor device (300) on the seating portion and to prevent the IC terminal leads from interfering with contact pins (20).

REFERENCES:
patent: 4846704 (1989-07-01), Ikeya
patent: 5020998 (1991-06-01), Ikeya et al.
patent: 5304072 (1994-04-01), Kunioka et al.
patent: 5320551 (1994-06-01), Mori et al.
patent: 5364284 (1994-11-01), Tohyama et al.
patent: 5409392 (1995-04-01), Marks et al.
patent: 5447444 (1995-09-01), Matsuoka
patent: 5658153 (1997-08-01), Ikeya et al.
patent: 5800194 (1998-09-01), Yamagishi

Affiliated with

Also associated with

Rating

Socket apparatus for IC packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Socket apparatus for IC packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket apparatus for IC packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-359755