Preparing method of IC card and IC card

Details Preparing method of IC card and IC card Preparing method of IC card and IC card

2006-04-04

2006-04-04

Stcyr, Daniel (Department: 2876)

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Conductive

Reexamination Certificate

active

07021550

ABSTRACT:
A method for preparing an IC card, the IC card has an IC module within an adhesive layer between first substrate and second substrate. In the method, an adhesive containing diphenylmethanediisocyanate an amount of less than percent by weight based on the whole amount the adhesive and having an elongation at fracture adhesive of 150–1,500 percent after complete curing is employed, and the blanc IC card sheet is cut when an elongation at fracture of the adhesive of 5–500 percent prior to complete curing.

REFERENCES:
patent: 4751124 (1988-06-01), Matsuzawa et al.
patent: 5180906 (1993-01-01), Yamada
patent: 5302438 (1994-04-01), Komamura et al.
patent: 5689136 (1997-11-01), Usami et al.
patent: 5999205 (1999-12-01), Taguchi et al.
patent: 6076737 (2000-06-01), Gogami et al.
patent: 6203934 (2001-03-01), Naoe et al.
patent: 6250555 (2001-06-01), Inamoto
patent: 6297075 (2001-10-01), Odajima et al.
patent: 6368529 (2002-04-01), Lloyd et al.
patent: 6638635 (2003-10-01), Hattori et al.
patent: 6703121 (2004-03-01), Iwabuchi et al.
patent: 2005/0175819 (2005-08-01), Kobayashi et al.
patent: 01-205155 (1989-08-01), None
patent: 10-316959 (1998-12-01), None
patent: 11-005964 (1999-01-01), None
patent: 2000-036026 (2000-02-01), None
patent: 2000148946 (2000-05-01), None
patent: 2000-211278 (2000-08-01), None
patent: 2000-219855 (2000-08-01), None
patent: 2002-175510 (2002-06-01), None
patent: 2002-222403 (2002-08-01), None

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