Method and apparatus for hermetic sealing of assembled die

Details Method and apparatus for hermetic sealing of assembled die Method and apparatus for hermetic sealing of assembled die

2006-07-18

2006-07-18

Tran, Mai-Huong (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C385S014000, C385S031000, C385S033000

Reexamination Certificate

active

07078263

ABSTRACT:
An optically transparent, hermetic coating is locally formed on die and other components already assembled in an existing nonhermetic structure. The local hermetic sealing of an OSA includes providing an OSA having at least one exposed optoelectronic component, and providing a paralene source. The method provides for positioning a mask between the paralene source and the OSA, the mask including an opening aligned with a first region of the OSA. The first region includes at least one of the exposed optoelectronic components. The paralene source is then caused to generate paralene such that a permanent paralene coating is deposited through the opening and on the first region of the OSA. The permanent paralene coating essentially hermetically seals the first region. The permanent paralene coating is chosen to be transparent to the wavelength of light emitted and/or used in the optical sub-assembly.

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