Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

2006-03-14

2006-03-14

Klemanski, Helene (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001260

Reexamination Certificate

active

07011697

ABSTRACT:
An electroless gold plating solution is provided that includes a cyanide compound and ascorbic acid or a derivative thereof, the electroless gold plating solution containing one or more than one deposition accelerator selected from the group consisting of a copper compound, a thallium compound, and a lead compound.

REFERENCES:
patent: 4481035 (1984-11-01), Andrascek et al.
patent: 5470381 (1995-11-01), Kato et al.
patent: 5614004 (1997-03-01), Wachi et al.
patent: 5803957 (1998-09-01), Murakami et al.
patent: 6336962 (2002-01-01), Backus et al.
patent: 6533849 (2003-03-01), Fang
patent: 2004/0118317 (2004-06-01), Iwai et al.
patent: 2005/0031895 (2005-02-01), Suda et al.
patent: 59-85855 (1984-05-01), None
patent: 60-125379 (1985-07-01), None
Okinaka, Y., “Electroless Gold Deposition Using Borohydride or Dimethylamine Borane as Reducing Agent,” Plating, 57, 914 (1970), no month available.
Kenkyukai, Denkimekki, “Electroless Plating Basics and Application,” The Nikkan Kogyo Shimbun, Ltd., 1994, 167-168, with an abridged English translation of section 7.1.4, no month.

Affiliated with

Also associated with

Rating

Electroless gold plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless gold plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless gold plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3595100